Description : Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Description : Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Description : Explores State-of-the-Art Work from the World’s Foremost Scientists, Engineers, Educators, and Practitioners in the Field Why use smart materials? Since most smart materials do not add mass, engineers can endow structures with built-in responses to a myriad of contingencies. In their various forms, these materials can adapt to their environments by changing characteristics and can provide information about structural and environmental changes. A single source on numerous aspects of intelligent materials Smart Materials focuses on many types of novel materials, including ceramics, hybrid composites, shape memory alloys, chitosan-based gels, adhesives, oxides, polymers, flip-chip technology, magnetorheological fluids, electrorheological materials, nanotubes, and sensors. It highlights the interdisciplinary nature of these materials by showing how they can be used in scores of areas, such as drug delivery systems, health monitoring, fiber optics, nanoscale engineering, vibration control, and molecular imprinting. Gain insight from leading experts who specialize in smart materials technology With over fifty years of experience working and teaching in this field, the editor has compiled numerous insightful contributions from an extensive group of leading experts. In this volume, they share their expertise and explore the innovative progress that has occurred in smart material products, components, systems, and structures.
Description : This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Description : Abstract: The increasing complexity of automotive-oriented Application Specific Integrated Circuits (ASICs) pushed the industry to innovative packaging solutions that are sometimes challenged by the severe automotive quality targets. This study is related to the characterization of an advanced Flip Chip Ball Grid Array (FC-BGA) package with copper pillar interconnections, specifically to its reliability performance versus the Temperature Cycling (aligned to AEC-Q100 Grade 1 perimeter). The thermo-mechanical stress – due to the different Coefficients of Thermal Expansion (CTEs) of the materials in the system – is the root cause of a failure event never discovered before: cracked pads at the aluminium layer level, just below the Cu pillar, showing the symptoms of metal fatigue. Starting from the consolidated Coffin–Manson law, a refined acceleration model for this new failure mechanism is here proposed. It assumes the existence of a stress-free temperature range, which is defined as the portion of the entire thermal load that does not produce fatigue on the pillar stack. The stress-free temperature range hypothesis and the estimate of its extent were validated through a good fitting of the data coming from the experimental trials performed on the aforementioned copper pillar FC-BGA package. The model obtained was employed to allow a more accurate failure rate prediction for the studied Flip Chip package for automotive applications. Highlights: This study is related to the characterization of an advanced Flip Chip BGA package with copper pillar interconnections. The thermal fatigue is the root cause of a failure event never discovered before: cracked pads at the aluminium layer level. Starting from the consolidated Coffin–Manson law, a refined acceleration model for this new failure mode is here proposed. The new model is based on the concept of stress-free temperature range. The stress-free temperature range method adopted has been validated through a good fitting of the data.
Description : Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Description : Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Description : 'Flip Chip' has come to describe a group of related technologies that are used for connecting a chip to a substrate without the use of wires. Instead of using traditional wire leads, the chip is literally placed upside down, lying directly upon the substrate. This is the first book on this topic, a comprehensive reference that covers the design, engineering, and manufacturing of these packages.
Description : Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging