Description : Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Description : The proceedings of the International Congress (c) include about 120 papers selected out of 160 papers submitted for presentations at APCF/SIF-2014, to be held in Sydney, Australia, December 9-12, 2014, and uniting the Asian-Pacific Conference on Fracture and Strength 2014 (APCFS-2014) with the International Conference on Structural Integrity and Failure (SIF-2014). The congress will be hosted by The University of Sydney and co-organized by Australia Fracture Group (AFG), the Chinese Mechanical Engineering Society, Materials Institution (CMES-MI), the Korean Society of Mechanical Engineers, Materials and Fracture Division (KSME-MFD) and The Japanese Society of Mechanical Engineers, Materials and Mechanics Division (JSME-MMD). The congress follows the series of the previous very successful APCF and SIF international forums, in particular, APCFS 2012, Busan and the 8th SIF, Melbourne, 2013. Characterisations of complex mechanisms of damage accumulation and failure Application of new multi-scale modelling approaches in problems associated with structural integrity Development of more accurate technologies for structural damage assessment
Description : Advances in Silicic Acid Research and Application: 2013 Edition is a ScholarlyBrief™ that delivers timely, authoritative, comprehensive, and specialized information about ZZZAdditional Research in a concise format. The editors have built Advances in Silicic Acid Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about ZZZAdditional Research in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Advances in Silicic Acid Research and Application: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.
Description : This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Description : Hydroxides—Advances in Research and Application: 2013 Edition is a ScholarlyEditions™ book that delivers timely, authoritative, and comprehensive information about Calcium Hydroxide. The editors have built Hydroxides—Advances in Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Calcium Hydroxide in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Hydroxides—Advances in Research and Application: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.
Description : Microsystems are an important factor that contribute to an automobile model's success. To meet the customer's desire for safety, convenience and vehicle economy, and to satisfy environmental standards, microsystems play a critical factor. Microsystems applications (MST) have already resulted in improved performance and better value for money. But the advances implemented reveal only the beginning of a revolution in the vehicle sector, which aims at a complete transition from the mechanically driven automobile system to a mechanically based but ICT-driven system. The selected contributions from AMAA 2003 treat safety (both preventive and protective), powertrain (online measurement and control of engine and transmission subsystems), comfort and HMI (systems to enhance the comfort of passengers and human machine interface issues), and networked Vehicle (all aspects of intra car systems and ambient communication networks).
Description : Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.