Description : Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Description : Micro-miniaturization in electronics--a necessity for personal communications devices like cell phones and PDAs--has radically altered the materials these electronics are made from. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and microminiature sizes, and will be an invaluable tool to anyone working in electronic packaging, fabrication, or assembly design. * ALL NEW--A complete rewrite of the previous edition * Details and characterizes every major material type, allowing engineers to make accurate, cost-effective design choices * Full materials breakdown for high density packaging techniques * Materials for communications wiring and cabling
Description : Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices. Reviews the properties and production of various flexible organic materials. Describes the integration technologies of flexible organic electronics and their manufacturing methods. Looks at the application of flexible organic materials in smart integrated systems and circuits, chemical sensors, microfluidic devices, organic non-volatile memory devices, and printed batteries and other power storage devices.
Description : The second, updated edition of this essential reference book provides a wealth of detail on a wide range of electronic and photonic materials, starting from fundamentals and building up to advanced topics and applications. Its extensive coverage, with clear illustrations and applications, carefully selected chapter sequencing and logical flow, makes it very different from other electronic materials handbooks. It has been written by professionals in the field and instructors who teach the subject at a university or in corporate laboratories. The Springer Handbook of Electronic and Photonic Materials, second edition, includes practical applications used as examples, details of experimental techniques, useful tables that summarize equations, and, most importantly, properties of various materials, as well as an extensive glossary. Along with significant updates to the content and the references, the second edition includes a number of new chapters such as those covering novel materials and selected applications. This handbook is a valuable resource for graduate students, researchers and practicing professionals working in the area of electronic, optoelectronic and photonic materials.
Description : Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Description : The result of a joint effort between representatives of private industry and academia, the publication is divided into sections on elements, alloys, insulators and compound semi-conductors. An index and bibliography are lacking. Numerous simple graphs and charts are provided, in fact most of the boo
Description : Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Description : An innovative resource for materials properties, their evaluation, and industrial applications The Handbook of Materials Selection provides information and insight that can be employed in any discipline or industry to exploit the full range of materials in use today-metals, plastics, ceramics, and composites. This comprehensive organization of the materials selection process includes analytical approaches to materials selection and extensive information about materials available in the marketplace, sources of properties data, procurement and data management, properties testing procedures and equipment, analysis of failure modes, manufacturing processes and assembly techniques, and applications. Throughout the handbook, an international roster of contributors with a broad range of experience conveys practical knowledge about materials and illustrates in detail how they are used in a wide variety of industries. With more than 100 photographs of equipment and applications, as well as hundreds of graphs, charts, and tables, the Handbook of Materials Selection is a valuable reference for practicing engineers and designers, procurement and data managers, as well as teachers and students.
Description : According to Nalwa (founder and editor-in-chief of the Journal of Nanoscience and Nanotechnology), organic materials and polymers offer a range of advantages in electronic and photonic applications, including a higher degree of tailoring and versatility in the manipulation of their physical properties, ease of modification and functionalization, ease of processing and fabrication, low-cost mass production, environmental stability, and biocompatibility. He presents a three-volume handbook covering the synthesis and electrical properties of these materials, as well as a range of applications. The first volume, on electronic materials and devices, includes 13 chapters discussing such topics as synthetic approaches to band gap control in conjugated polymeric materials; synthesis, characteristics, and applications of conducting polymer nanotubes, nanowires, and nanocomposites; charge transport and morphology in conjugated polymers; nano/microfabrication techniques for organic electronics and photonics, self-assembled supramolecular structures for organic electronics and photonics; organic thin-film transistor fundamentals and applications; electropolymers for mechtronics and artificial muscles; and biologically inspired large contraction conducting polymer actuators. The second volume switches focus towards photonic materials and devices and includes 12 chapters discussing such topics as organic nonlinear optical crystals and single-crystalline thin films, organic semiconducting thin films, organic random lasers, nonlinear optical properties of organometallic and metalloorganic compounds, nonlinear optical responses and photoinduced electron transfer process in phthalocyanines and related compounds, liquid crystal diffractive optical elements, magnetoresistance and spin effects in organic light-emitting diodes, and photoinduced transfer between electron donors and fullerenes as unique electron acceptors. The final volume is concerned with devices and includes 10 chapters on such topics single-molecule transistors; nanostructured arrays as suitable materials for batteries, sensors, and electrochromic devices; organic field-effect transistors; flexible display applications in organic electronics and photonics; physics and technology and organic light emitting diodes; organic and polymeric solar cells; luminescent lanthanide complexes for advanced photonic applications; and DNA based biosensors.