Description : Going "green" is becoming a major component of the mission for electronics manufacturers worldwide. While this goal seems simplistic, it poses daunting dilemmas. Yet, to compete effectively in the global economy, manufacturers must take the initiative to drive this crucial movement. Green Electronics Manufacturing: Creating Environmental Sensible Products provides you with a complete reference to design, develop, build, and install an electronic product with special consideration for the product’s environmental impacts during its whole life cycle. The author discusses how to integrate the state-of-the-art technologies of finite element method (FEM) modeling, simulation, and testing to create environmental sensible products of satisfying global environmental regulations, such as Restriction of Hazardous Substances (ROHS) compliance. He covers enabling techniques such as advanced fatigue life modeling, crack propagation analysis, and probabilistic robust design of lead-free electronics. The book also explores how risk engineering methodology empowers practitioners with effective tools such as buckling analysis of tin whiskers. With its emphasis on reducing parts, rationing materials, and reusing components to make products more efficient to build, green electronics intertwines today’s electronics with manufacturing strategies of global sourcing, concurrent engineering, and total quality. Implemented through product and process design, it can help you achieve sustainability to support future generations and at the same time preserve our natural resources. Green Electronics Manufacturing: Creating Environmental Sensible Products gives you the tools to create environmental sensible products while maintaining electronics quality and reliability.
Description : "I have never come across a single book that explains the history, design, and use of cleanroom robotics for electronics manufacturing so thoroughly. This is a must read for anyone designing cleanroom equipment for electronics manufacturing!" Jeff Baird, Director of Engineering, Adept Technology, inc "A must read for anyone working on semiconductor or flat panel robotics. This book captures theory, applications, and best practices." Dr. Martin P. Aalund, Director NPI Engineering, KLA-Tencor Corp. "The definitive reference for cleanroom robotics, as well as a practical guide for anyone who wishes to go beyond theory to the economic justifications and real-world commercial requirements to deploy robot technology." Dr. Rich Mahoney, Director of Robotics, Engineering & Systems Division, SRI International From the history and evolution of cleanroom automation to the latest applications and industry standards, this book provides the only available complete overview of robotics for electronics manufacturing. Numerous real-world examples enable you to learn from professional experience, maximize the design quality, and avoid expensive design pitfalls. You'll also get design guidelines and hands-on tips for reducing design time and cost, Compliance with industry and de-facto standards for design, assembly, and handling is stressed throughout, and detailed discussions of recommended materials for atmospheric and vacuum robots are included to help shorten product development cycles and avoid expensive material testing.
Description : Describes this process at it relates to the electronics industry, focusing on such areas as printed wiring boards, networking, automatic assembly, surface mount technology, tape automated bonding, bar coding, and electro-static discharge. Also studies the effects of group work ethics as a factor in
Description : This volume provides a comprehensive introduction to electronic technology, products, and manufacturing processes.Reviews principles of production and electronics fundamentals (electronic components, interconnections, printed wiring boards, soldering and solderability); explains automatic assembly (automation, leaded component insertion, and surface-mount device placement); discusses life-cycle engineering (design for assembly, quality and reliability, testability, and environmental stress screening); and explores manufacturing systems (facilities and materials handling, production and inventory control, production economics).For electrical or industrial engineers interested in electronics manufacturing.
Description : Flexible Electronics for Security, Manufacturing, and Growth in the United States is the summary of a workshop convened in September 2010 by Policy and Global Affairs' Board on Science, Technology, and Economic Policy to review challenges, plans, and opportunities for growing a robust flexible electronics industry in the United States. Business leaders, academic experts, and senior government officials met to review the role of research consortia around the world to advance flexible electronics technology. Presenters and participants sought to understand their structure, focus, funding, and likely impact, and to determine what appropriate steps the United States might consider to develop a robust flexible electronics industry. Flexible electronics refers to technologies that enable flexibility in the manufacturing process as well as flexibility as a characteristic of the final product. Features such as unconventional forms and ease of manufacturability provide important advantages for flexible electronics over conventional electronics built on rigid substrates. Today, examples of flexible electronics technologies are found in flexible flat-panel displays, medical image sensors, photovoltaic sheets, and electronic paper. Some industry experts predict that the market for global flexible electronics will experience a double digit growth rate, reaching $250 billion by 2025, but most experts believe that the United States is not currently poised to capitalize on this opportunity. Flexible Electronics for Security, Manufacturing, and Growth in the United States examines and compares selected innovation programs, both foreign and domestic, and their potential to advance the production of flexible electronics technology.
Description : The sequence of events which led to the writing of this book started at a seminar on Manufacturing Technology in the Electronics Industry given by the Institution of Production Engineers in 1987. The seminar identified that the field of manufacturing engineering for the electronics industry was effectively missing from the vast majority of production engineering degree courses. The reason for this was that production engineering departments typically spring from mechanical engineering departments. This leads to a mechanical bias in the practical aspects of such courses. The consequence of this was that electronics companies could not recruit graduates with both relevant production engineering and electronic engineering backgrounds. This necessitated either recruiting production engineering graduates and giving them the necessary electronic engineering training, or giving production engineering training to electronic engineering graduates. A consequence of the lack of courses in a subject is that there is also a lack of relevant textbooks in the area, as most textbooks are intended to tie into courses. In the field of manufacturing technology for the electronics industry, existing textbooks tend to be highly specialized and mainly concerned with the fabrication of semiconductor devices.
Description : About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Description : This book provides an overview of essential research on and developments in the electrohydrodynamic (EHD) direct-writing technique and its applications. Firstly, it presents mechano- and helix electrospinning methods to achieve direct writing of straight/serpentine micro/nano fibers in high resolution. Secondly, it examines functional inks and multi nozzle arrays for EHD printing, which are used to efficientlyform patterns and devices. Thirdly, the book discusses the various control methods adopted in the context of EHD to improve the controllability of the electrospun fibers. Lastly, it addresses the equipment used in EHD printing and its applications, while also outlining challenges for the field’s future development. Combining academic and industrial viewpoints, the book provides in-depth information for experienced researchers, as well as a valuable guide for those just entering the field.