Fundamentals Of Lead Free Solder Interconnect Technology

Author by : Tae-Kyu Lee
Languange : en
Publisher by : Springer
Format Available : PDF, ePub, Mobi
Total Read : 89
Total Download : 985
File Size : 42,7 Mb
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Description : This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.


Contemporary Approaches In Material Science And Materials Processing Technologies

Author by : Antoinio Apicella
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 12
Total Download : 451
File Size : 55,6 Mb
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Description : Collection of selected, peer reviewed papers from the 2nd International Conference on Materials Science and Engineering Technology (MSET 2015), April 25-26, 2015, Shanghai, China. The 274 papers are grouped as follows: Chapter 1: Films, Ceramics and Glasses; Chapter 2: Electrochemistry, Chemical Materials and Technologies; Chapter 3: Nanomaterials and Nanotechnologies; Chapter 4: Materials for Microelectronic Industry and Magnetic Materials; Chapter 5: New Functional Materials; Chapter 6: Polymers, Composites and Compounds; Chapter 7: Surface of Materials, Coatings and Surface Engineering; Chapter 8: Biomaterials, Biotechnology and Biochemistry; Chapter 9: Metals and Alloys in Industrial Applications; Chapter 10: Materials Processing Technologies; Chapter 11: Engineering of Technological Processes; Chapter 12: Building Materials and Technologies in Construction.


Die Attach Materials For High Temperature Applications In Microelectronics Packaging

Author by : Kim S. Siow
Languange : en
Publisher by : Springer
Format Available : PDF, ePub, Mobi
Total Read : 20
Total Download : 580
File Size : 49,7 Mb
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Description : This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.


Lead Free Solder Interconnect Reliability

Author by : Dongkai Shangguan
Languange : en
Publisher by : ASM International
Format Available : PDF, ePub, Mobi
Total Read : 86
Total Download : 498
File Size : 42,7 Mb
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Description :


Fundamentals Of Device And Systems Packaging Technologies And Applications Second Edition

Author by : Rao Tummala
Languange : en
Publisher by : McGraw Hill Professional
Format Available : PDF, ePub, Mobi
Total Read : 45
Total Download : 655
File Size : 53,8 Mb
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Description : A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field


Technology Development And Marketing

Author by : Junmo Kim
Languange : en
Publisher by : AuthorHouse
Format Available : PDF, ePub, Mobi
Total Read : 56
Total Download : 868
File Size : 44,7 Mb
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Description : Technology development needs a market. Since technology development is from supply side, it is always crucial to pay attention to the demand side of technology. Taking this notion as an underlying assumption, this book discusses a technology development case in the realm of microelectronic packaging technology based on a real case study of a three-year consecutive research and development program conducted in Korea with expandable implications for other contexts.


Lead Free Solders

Author by : K. Subramanian
Languange : en
Publisher by : John Wiley & Sons
Format Available : PDF, ePub, Mobi
Total Read : 19
Total Download : 731
File Size : 52,9 Mb
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Description : Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.


Electronic Packaging And Interconnection Handbook 4 E

Author by : Charles Harper
Languange : en
Publisher by : McGraw Hill Professional
Format Available : PDF, ePub, Mobi
Total Read : 26
Total Download : 257
File Size : 44,6 Mb
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Description : Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?


Electronic Materials And Processes Handbook

Author by : Charles A. Harper
Languange : en
Publisher by : McGraw Hill Professional
Format Available : PDF, ePub, Mobi
Total Read : 83
Total Download : 476
File Size : 41,6 Mb
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Description : Micro-miniaturization in electronics--a necessity for personal communications devices like cell phones and PDAs--has radically altered the materials these electronics are made from. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and microminiature sizes, and will be an invaluable tool to anyone working in electronic packaging, fabrication, or assembly design. * ALL NEW--A complete rewrite of the previous edition * Details and characterizes every major material type, allowing engineers to make accurate, cost-effective design choices * Full materials breakdown for high density packaging techniques * Materials for communications wiring and cabling


Handbook Of Lead Free Solder Technology For Microelectronic Assemblies

Author by : Karl J. Puttlitz
Languange : en
Publisher by : CRC Press
Format Available : PDF, ePub, Mobi
Total Read : 54
Total Download : 280
File Size : 42,8 Mb
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Description : This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif