Fundamentals Of Lead Free Solder Interconnect Technology

Author by : Tae-Kyu Lee
Languange : en
Publisher by : Springer
Format Available : PDF, ePub, Mobi
Total Read : 37
Total Download : 403
File Size : 40,7 Mb
pdf pdf

Description : This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.


Die Attach Materials For High Temperature Applications In Microelectronics Packaging

Author by : Kim S. Siow
Languange : en
Publisher by : Springer
Format Available : PDF, ePub, Mobi
Total Read : 70
Total Download : 766
File Size : 46,8 Mb
pdf pdf

Description : This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.


Lead Free Solder Interconnect Reliability

Author by : Dongkai Shangguan
Languange : en
Publisher by : ASM International
Format Available : PDF, ePub, Mobi
Total Read : 87
Total Download : 874
File Size : 48,6 Mb
pdf pdf

Description :


Fundamentals Of Device And Systems Packaging Technologies And Applications Second Edition

Author by : Rao Tummala
Languange : en
Publisher by : McGraw Hill Professional
Format Available : PDF, ePub, Mobi
Total Read : 64
Total Download : 425
File Size : 52,5 Mb
pdf pdf

Description : A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field


Technology Development And Marketing

Author by : Junmo Kim
Languange : en
Publisher by : AuthorHouse
Format Available : PDF, ePub, Mobi
Total Read : 38
Total Download : 781
File Size : 40,7 Mb
pdf pdf

Description : Technology development needs a market. Since technology development is from supply side, it is always crucial to pay attention to the demand side of technology. Taking this notion as an underlying assumption, this book discusses a technology development case in the realm of microelectronic packaging technology based on a real case study of a three-year consecutive research and development program conducted in Korea with expandable implications for other contexts.


Handbook Of Lead Free Solder Technology For Microelectronic Assemblies

Author by : Karl J. Puttlitz
Languange : en
Publisher by : CRC Press
Format Available : PDF, ePub, Mobi
Total Read : 69
Total Download : 666
File Size : 51,7 Mb
pdf pdf

Description : This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.


Electronic Packaging And Interconnection Handbook 4 E

Author by : Charles Harper
Languange : en
Publisher by : McGraw Hill Professional
Format Available : PDF, ePub, Mobi
Total Read : 59
Total Download : 902
File Size : 49,8 Mb
pdf pdf

Description : Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?


Electronic Materials And Processes Handbook

Author by : Charles A. Harper
Languange : en
Publisher by : McGraw Hill Professional
Format Available : PDF, ePub, Mobi
Total Read : 63
Total Download : 109
File Size : 40,8 Mb
pdf pdf

Description : Micro-miniaturization in electronics--a necessity for personal communications devices like cell phones and PDAs--has radically altered the materials these electronics are made from. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and microminiature sizes, and will be an invaluable tool to anyone working in electronic packaging, fabrication, or assembly design. * ALL NEW--A complete rewrite of the previous edition * Details and characterizes every major material type, allowing engineers to make accurate, cost-effective design choices * Full materials breakdown for high density packaging techniques * Materials for communications wiring and cabling


Lead Free Solder Process Development

Author by : Gregory Henshall
Languange : en
Publisher by : John Wiley & Sons
Format Available : PDF, ePub, Mobi
Total Read : 16
Total Download : 910
File Size : 43,6 Mb
pdf pdf

Description : Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.


Mechanics Of Solder Alloy Interconnects

Author by : Darrel R. Frear
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 29
Total Download : 583
File Size : 55,9 Mb
pdf pdf

Description : The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.