Green Electronics Manufacturing

Author by : John X. Wang
Languange : en
Publisher by : CRC Press
Format Available : PDF, ePub, Mobi
Total Read : 15
Total Download : 951
File Size : 41,5 Mb
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Description : Going "green" is becoming a major component of the mission for electronics manufacturers worldwide. While this goal seems simplistic, it poses daunting dilemmas. Yet, to compete effectively in the global economy, manufacturers must take the initiative to drive this crucial movement. Green Electronics Manufacturing: Creating Environmental Sensible Products provides you with a complete reference to design, develop, build, and install an electronic product with special consideration for the product’s environmental impacts during its whole life cycle. The author discusses how to integrate the state-of-the-art technologies of finite element method (FEM) modeling, simulation, and testing to create environmental sensible products of satisfying global environmental regulations, such as Restriction of Hazardous Substances (ROHS) compliance. He covers enabling techniques such as advanced fatigue life modeling, crack propagation analysis, and probabilistic robust design of lead-free electronics. The book also explores how risk engineering methodology empowers practitioners with effective tools such as buckling analysis of tin whiskers. With its emphasis on reducing parts, rationing materials, and reusing components to make products more efficient to build, green electronics intertwines today’s electronics with manufacturing strategies of global sourcing, concurrent engineering, and total quality. Implemented through product and process design, it can help you achieve sustainability to support future generations and at the same time preserve our natural resources. Green Electronics Manufacturing: Creating Environmental Sensible Products gives you the tools to create environmental sensible products while maintaining electronics quality and reliability.


Exam Prep For Green Electronics Manufacturing Creating

Author by : David Mason
Languange : en
Publisher by : Rico Publications
Format Available : PDF, ePub, Mobi
Total Read : 34
Total Download : 691
File Size : 42,7 Mb
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Description : 5,600 Exam Prep questions and answers. Ebooks, Textbooks, Courses, Books Simplified as questions and answers by Rico Publications. Very effective study tools especially when you only have a limited amount of time. They work with your textbook or without a textbook and can help you to review and learn essential terms, people, places, events, and key concepts.


Exam Prep For Green Electronics Manufacturing Creating Environmental Sensible Products

Author by : Dave Mason
Languange : en
Publisher by : Rico Publications
Format Available : PDF, ePub, Mobi
Total Read : 18
Total Download : 751
File Size : 40,8 Mb
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Description : 5,600 Exam Prep questions and answers. Ebooks, Textbooks, Courses, Books Simplified as questions and answers by Rico Publications. Very effective study tools especially when you only have a limited amount of time. They work with your textbook or without a textbook and can help you to review and learn essential terms, people, places, events, and key concepts.


Green Electronics Green Bottom Line

Author by : Lee H Goldberg
Languange : en
Publisher by : Elsevier
Format Available : PDF, ePub, Mobi
Total Read : 80
Total Download : 949
File Size : 44,5 Mb
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Description : Environmentally safe engineering is one of the hottest and most controversial topics in technical circles. Though many publications offer theory and intellectual discussion of the topic, this book provides practical, hands-on advice including hints and tips from the nation's top engineers. Green Electronics/Green Bottom Line offers practical advice for engineers and managers who want or need to incorporate environmental issues into the design process. The emerging discipline of Design for the Environment (DfE) combines engineering know-how with environmental awareness. Topics include international policy issues such as ISO 14000, materials selection (e.g., for recyclability), manufacturing concerns like no-flux processes, and design issues such as power consumption. Real-world cases show how these elements can be included in everyday designs. Each chapter opens with a topical cartoon and lively story, interview or editorial. The discussion will then move to specific engineering issues and their economic and social context. The last section explores larger possibilities and new directions still to be explored by engineers concerned with education, health, and environmental quality. Contributors include engineers from Motorola, Analog Devices, Dupont, Compaq, Nortel, AMD, and Apple Computer, and academics from universities in the US, Canada, the UK, and Europe, as well as the Rocky Mountain Institute. An everyday guide to environmentally sound electronics design Contributors include top engineers from the biggest electronics manufacturers and most prestigious universities Real-world cases illustrate topics giving concepts the reader can apply immediately


Electronics Manufacturing

Author by : John H. Lau
Languange : en
Publisher by : McGraw Hill Professional
Format Available : PDF, ePub, Mobi
Total Read : 51
Total Download : 592
File Size : 47,8 Mb
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Description : ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: * Chip (wafer) level interconnects with lead-free solder bumps * Lead-free solder wafer bumping with micro-ball mounting and paste printing methods * Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates * Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs * Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate * Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages * Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging * Environmental issues for conventional PCBs and substrates * Some environmentally conscious flame-retardants for PCBs and organic substrates * Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety * Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives * Criteria, development approaches, and varieties of alloys and properties of lead-free solders * Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders * Manufacturing process and performance of lead-free surface finishes for both PCB and component applications * Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process * Fundamental understanding of electrically conductive adhesive (ECA) technology * Effects of lubricant removal and cure shrinkage on ECAs * Mechanisms underlying the contact resistance shifts of ECAs * Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs * Stabilization of contact resistance of ECAs using various additives


Cellular Manufacturing

Author by : John X. Wang
Languange : en
Publisher by : CRC Press
Format Available : PDF, ePub, Mobi
Total Read : 40
Total Download : 289
File Size : 54,5 Mb
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Description : In today’s business world, competitiveness defines the industrial leading edge. Organizations and businesses of all sizes are adopting Lean manufacturing practices to increase efficiency and address worries about their bottom lines. In a detailed review of this staple of Lean manufacturing, Cellular Manufacturing: Mitigating Risk and Uncertainty outlines how cellular manufacturing can do just that. It demonstrates how this approach can help you and your teams build a variety of products with as little waste as possible. The book begins by presenting a survey of the current state of existing methods that can best be used in the handling of the bottleneck machines and parts problem, which results from the cellular manufacturing system design. It then explores how decision making under risk is used to help the designer select the best cell arrangement in case of probabilistic production volume and maximize the profit imposed by resource capacity constraints. The author then presents a method for the system design of a manufacturing cell that aims for profit maximization over a certain period of time. He also discusses robust design, illustrated with a real application. Put simply, cellular manufacturing integrates machinery and a small team of staff, directed by a team leader, so all the work on a product or part can be accomplished in the same cell eliminating resources that do not add value to the product. A concise yet unique reference, this book incorporates decision making under risk into cellular manufacturing. The text makes the link that ties cellular manufacturing to the bottom line. It helps you recognize savings opportunities from elimination of downtime between operations, decreased material handling costs, decreased work-in-progress inventory and associated costs, reduced opportunity for handling errors, decreased downtime spent waiting for supplies or materials, and reduced losses from defective or obsolete products.


Lead Free Solder

Author by : John Hock Lye Pang
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 56
Total Download : 115
File Size : 52,5 Mb
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Description : Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.


Electronic Waste Management

Author by : Ronald E. Hester
Languange : en
Publisher by : Royal Society of Chemistry
Format Available : PDF, ePub, Mobi
Total Read : 64
Total Download : 245
File Size : 48,9 Mb
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Description : The book deals with the full range of waste management issues, including recycling and recovery of materials and design considerations for waste minimisation. In addition, the book also contains a wide variety of illustrative case studies. With detailed and comprehensive coverage of the subject matter, an extensive bibliography is provided with each chapter. Electronic Waste Management is essential reading for all involved with electrical and electronic waste management through its comprehensive review of recent EU legislation and the subsequent impact on manufacturers and users of electronic equipment.


Exin Green It Foundation

Author by : René Visser
Languange : en
Publisher by : Van Haren
Format Available : PDF, ePub, Mobi
Total Read : 49
Total Download : 946
File Size : 47,8 Mb
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Description : This workbook is meant to fully prepare yourself on the exam of EXIN Green IT Foundation. Topics dealt with are Understanding Green IT; Lifecycle management; Optimizing the Infrastructure; IT as Enabler; Governance and processes for Green IT. In this workbook you will find 40 multiple choice exam questions from the EXIN sample exam and to help increase your knowledge about Green IT we also have included so-called “get it” questions. The exam requirements and weight are specified in the exam specifications, mentioned in advance of every chapter of the workbook. The certificate is designed for Everyone who wishes to prepare for the EXIN Green IT Foundation exam and everyone interested in the basics of greening IT: - IT professionals and sustainability officers seeking to reduce costs, increase efficiency and/or reduce the organizations environmental footprint through technology. - Managers and professionals in the IT organization who need to transform IT operations to a more sustainable and cost effective service provision model.


Lead Free Electronics

Author by : Edwin Bradley
Languange : en
Publisher by : John Wiley & Sons
Format Available : PDF, ePub, Mobi
Total Read : 13
Total Download : 322
File Size : 52,8 Mb
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Description : Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.