High Performance Polymers Conductive Adhesives

Author by : Guy Rabilloud
Languange : en
Publisher by : Technip Editions
Format Available : PDF, ePub, Mobi
Total Read : 62
Total Download : 163
File Size : 50,6 Mb
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Description : High performance polymers are extensively used in the fabrication, assembly and packaging of semiconductor components. The basic purpose of this book is to review the present status of the electrically conductive and thermally conductive adhesive technology, primarily for the well established die attach market, but also for the anisotropic adhesive films used to interconnect electronic drivers to liquid crystal display panels, and adhesives which are currently tested to replace soft solders in the surface mount technology. Contents: 1. Applications, market survey and standards. 2. Electrical and thermal conductivities. 3. Fillers and resins. 4. Properties of uncured adhesives. 5. Properties of cured adhesives. 6. Thermally-induced stresses. 7. Reliability concerns. 8. Current developments.


High Performance Polymer

Author by : Guy Rabilloud
Languange : en
Publisher by : Editions OPHRYS
Format Available : PDF, ePub, Mobi
Total Read : 18
Total Download : 824
File Size : 41,7 Mb
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Description : High performance polymers are extensively used in the fabrication, assembly and packaging of semiconductor components. The basic purpose of this book is to review the present status of the electrically conductive and thermally conductive adhesive technology, primarily for the well established die attach market, but also for the anisotropic adhesive films used to interconnect electronic drivers to liquid crystal display panels, and adhesives which are currently tested to replace soft solders in the surface mount technology. Contents: 1. Applications, market survey and standards. 2. Electrical and thermal conductivities. 3. Fillers and resins. 4. Properties of uncured adhesives. 5. Properties of cured adhesives. 6. Thermally-induced stresses. 7. Reliability concerns. 8. Current developments.


High Performance Polymers

Author by : Guy Rabilloud
Languange : en
Publisher by : Editions TECHNIP
Format Available : PDF, ePub, Mobi
Total Read : 19
Total Download : 908
File Size : 55,8 Mb
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Description : Both polymers have been used to make high performance adhesives, composites, coatings, films, fibres and foams which are now commercially available. This is a general reference book for materials scientists, polymer chemists, manufacturers of electronic components and process engineers. It is also a textbook for libraries of major chemical companies, research institutions, government laboratories and universities.Contents: 1. Polyphenylquinoxalines and related polymers. 2. Polyphenylquinoxaline solution properties. 3. Polyphenylquinoxaline film properties. 4. Application of polyphenylquinoxaline films. 5. Adhesion of polyphenylquinoxalines. 6. Polyimide chemistry. 7. Cardo polyimides: chemistry and properties. 8. Polyimides: properties and applications. Bibliography. Index.


Electrically Conductive Adhesives

Author by : Rajesh Gomatam
Languange : en
Publisher by : BRILL
Format Available : PDF, ePub, Mobi
Total Read : 95
Total Download : 385
File Size : 55,8 Mb
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Description : This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).


Materials For Advanced Packaging

Author by : Daniel Lu
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 58
Total Download : 959
File Size : 43,8 Mb
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Description : Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.


Handbook Of Adhesives And Sealants

Author by : Philippe Cognard
Languange : en
Publisher by : Elsevier
Format Available : PDF, ePub, Mobi
Total Read : 21
Total Download : 920
File Size : 41,5 Mb
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Description : Contributions from more than 60 authors, each a well-known specialist in their field, have been co-ordinated to produce the most comprehensive Handbook of Adhesives and Sealants ever published. The handbook will be published as 8 volumes, over a period of 4 years and will contain over 2800 pages, rich with case studies, industrial applications and the latest research. It is a work in progress, enabling the latest new and important applications to be included as they happen. Volume 2 of Elsevier’s Handbook of Adhesives & Sealants Series, General knowledge, application of adhesives & new curing techniques, covers the mechanisms of adhesion, its application, and drying and curing techniques. The volume is divided in to the following sections: • Theory of adhesion • Metering and dispensing • Design and calculation of bonded joints • Heat stable adhesives • UV curing • Flexible bonding and sealants Each contributing author is a scientist, practitioner, engineer, or chemist with an abundance of practical experience in their respective field, making this text an authoritative reference source for any materials scientist or engineer, whether in academia or industry.


Conference Proceedings

Author by : Society of Plastics Engineers. Technical Conference
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 74
Total Download : 780
File Size : 41,9 Mb
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Description :


High Performance Printed Circuit Boards

Author by : Charles A. Harper
Languange : en
Publisher by : McGraw Hill Professional
Format Available : PDF, ePub, Mobi
Total Read : 87
Total Download : 611
File Size : 55,8 Mb
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Description : A guided tour through the new generation of high-performance printed circuit boards (PCBs) and ceramic substrates Packed with leading-edge information, including data, details and guidelines on microvias, built-up multi-layers, high-density boards, and advanced ceramic substrates Covers environmentally safe PCB materials and processes Essential for electronics engineers, designers, and technicians--plus manufacturing and mechanical engineers


Advanced Materials For Thermal Management Of Electronic Packaging

Author by : Xingcun Colin Tong
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 14
Total Download : 508
File Size : 45,9 Mb
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Description : The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.


Electronics Packaging Technology Conference 2002 4th

Author by : Charles Lee
Languange : en
Publisher by : IEEE Standards Office
Format Available : PDF, ePub, Mobi
Total Read : 67
Total Download : 524
File Size : 55,9 Mb
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Description :