International Symposium On Advanced Packaging Materials

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Proceedings 3rd International Symposium On Advanced Packaging Materials

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Proceedings 4th International Symposium On Advanced Packaging Materials Processes Properties And Interfaces Chateau Elan Braselton Georgia March 15 18 1998

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International Symposium On Advanced Packaging Materials

Author by : C. P. Wong
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Description : The 5th International Symposium on Advanced Packaging Materials was devoted to the advances made in electronic packaging materials. Topics covered in these proceedings include adhesives, integral passive materials, on-chip interconnect materials, underfills and encapsulent materials.


1997 International Symposium On Advanced Packaging Materials

Author by : IEEE Components, Packaging and Manufacturing Technology Society Staff
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International Symposium On Advanced Packaging Materials Processes Properties And Interfaces Proceedings Chateau Elan Braselton Georgia March 6 8 2000

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International Symposium On Advanced Packaging Materials Processes Properties And Interfaces Proceedings Chateau Elan Braselton Georgia March 14 17 1999

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Ieee International Symposium And Exhibition On Advanced Packaging Materials Processes Properties And Interfaces March 15 17 2006 Atlanta Ga

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Proceedings

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Description : This collection of papers from the symposium discusses electrical design, analysis and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.


Ieee International Symposium And Exhibition On Advanced Packaging Materials

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