International Symposium On Advanced Packaging Materials

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Proceedings 3rd International Symposium On Advanced Packaging Materials

Author by : International Symposium on Advanced Packaging Materials
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International Symposium On Advanced Packaging Materials

Author by : C. P. Wong
Languange : en
Publisher by : IEEE
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Description : The 5th International Symposium on Advanced Packaging Materials was devoted to the advances made in electronic packaging materials. Topics covered in these proceedings include adhesives, integral passive materials, on-chip interconnect materials, underfills and encapsulent materials.


International Symposium On Advanced Packaging Materials

Author by : James E. Morris
Languange : en
Publisher by : Institute of Electrical & Electronics Engineers(IEEE)
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Total Read : 88
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File Size : 51,7 Mb
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Description : Topics covered in this book include: active devices; automotive electronics; ball grid array package; chip scale packages; design, modelling, simulation; flex circuits; HDTV; high density packaging; intelligent transportation; interconnects, bonding; and laser processing.


Ieee International Symposium And Exhibition On Advanced Packaging Materials Processes Properties And Interfaces March 15 17 2006 Atlanta Ga

Author by : International Symposium on Advanced Packaging Materials
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Proceedings

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Languange : en
Publisher by : IEEE
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Total Read : 27
Total Download : 978
File Size : 40,7 Mb
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Description : This collection of papers from the symposium discusses electrical design, analysis and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.


Advanced Packaging Materials Processes Properties And Interfaces 2001 Proceedings International Symposium On

Author by : Georgia) International Symposium on Advanced Packaging Materials (2001 : Braselton
Languange : en
Publisher by : International Society of Hybrid
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Total Read : 56
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Materials For Advanced Packaging

Author by : Daniel Lu
Languange : en
Publisher by : Springer
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Total Read : 85
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File Size : 43,5 Mb
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Description : Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.


Proceedings

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Languange : en
Publisher by : IEEE
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Total Read : 14
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Description : This collection of papers from the symposium discusses electrical design, analysis and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.


8th International Advanced Packaging Materials Symposium

Author by : Components, Packaging & Manufacturing Technology Society
Languange : en
Publisher by : Institute of Electrical & Electronics Engineers(IEEE)
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Total Read : 71
Total Download : 948
File Size : 50,8 Mb
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Description :