International Symposium On Advanced Packaging Materials

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 98
Total Download : 654
File Size : 48,5 Mb
pdf pdf

Description :


International Symposium On Advanced Packaging Materials

Author by : C. P. Wong
Languange : en
Publisher by : IEEE
Format Available : PDF, ePub, Mobi
Total Read : 49
Total Download : 233
File Size : 42,6 Mb
pdf pdf

Description : The 5th International Symposium on Advanced Packaging Materials was devoted to the advances made in electronic packaging materials. Topics covered in these proceedings include adhesives, integral passive materials, on-chip interconnect materials, underfills and encapsulent materials.


Proceedings 3rd International Symposium On Advanced Packaging Materials

Author by : International Symposium on Advanced Packaging Materials
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 48
Total Download : 348
File Size : 45,7 Mb
pdf pdf

Description :


Ieee International Symposium And Exhibition On Advanced Packaging Materials Processes Properties And Interfaces March 15 17 2006 Atlanta Ga

Author by : International Symposium on Advanced Packaging Materials
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 10
Total Download : 735
File Size : 53,7 Mb
pdf pdf

Description :


Proceedings

Author by :
Languange : en
Publisher by : IEEE
Format Available : PDF, ePub, Mobi
Total Read : 60
Total Download : 649
File Size : 41,9 Mb
pdf pdf

Description : This collection of papers from the symposium discusses electrical design, analysis and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.


Proceedings

Author by :
Languange : en
Publisher by : IEEE
Format Available : PDF, ePub, Mobi
Total Read : 53
Total Download : 151
File Size : 55,9 Mb
pdf pdf

Description : This collection of papers from the symposium discusses electrical design, analysis and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.


Materials For Advanced Packaging

Author by : Daniel Lu
Languange : en
Publisher by : Springer
Format Available : PDF, ePub, Mobi
Total Read : 31
Total Download : 990
File Size : 45,7 Mb
pdf pdf

Description : Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.


Ieee International Symposium And Exhibition On Advanced Packaging Materials

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 60
Total Download : 744
File Size : 41,5 Mb
pdf pdf

Description :


The 1999 International Symposium And Exhibition On Advanced Packaging Materials

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 59
Total Download : 891
File Size : 48,8 Mb
pdf pdf

Description :


Electrically Conductive Adhesives

Author by : Rajesh Gomatam
Languange : en
Publisher by : CRC Press
Format Available : PDF, ePub, Mobi
Total Read : 23
Total Download : 757
File Size : 48,5 Mb
pdf pdf

Description : With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers, camcorders, watch electronics, hard-drive suspensions and a myriad of electronic equipments. Environmentally-friendly ECAs offer many advantages vis-à-vis solder, such as simple and low-temperature processing conditions, better thermo mechanical performance and finer pitch. This book is based on the two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to this topic. The book contains a total of 21 papers (reflecting overviews and original research) and is divided into three parts as follows: Part 1: Introduction and Recent Developments, Part 2: Mechanical, Durability and Reliability Aspects and Part 3: Characterization and Properties.