Investigations On Microstructure And Mechanical Properties Of The Cu Pb Free Solder Joint Interfaces

Author by : Qingke Zhang
Languange : en
Publisher by : Springer
Format Available : PDF, ePub, Mobi
Total Read : 50
Total Download : 530
File Size : 47,9 Mb
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Description : This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.


Investigations Of Microstructural Changes In Lead Free Solder Alloys By Means Of Phase Field Theories

Author by : Thomas Böhme
Languange : en
Publisher by : Cuvillier Verlag
Format Available : PDF, ePub, Mobi
Total Read : 35
Total Download : 196
File Size : 48,8 Mb
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Lead Free Solders

Author by : K. Subramanian
Languange : en
Publisher by : John Wiley & Sons
Format Available : PDF, ePub, Mobi
Total Read : 71
Total Download : 888
File Size : 44,8 Mb
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Description : Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.


Mems And Nanotechnology Volume 5

Author by : Gordon Shaw III
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 46
Total Download : 593
File Size : 43,6 Mb
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Description : MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology


Handbook Of Lead Free Solder Technology For Microelectronic Assemblies

Author by : Karl J. Puttlitz
Languange : en
Publisher by : CRC Press
Format Available : PDF, ePub, Mobi
Total Read : 34
Total Download : 819
File Size : 42,5 Mb
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Description : This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif


Materials Transactions

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 16
Total Download : 502
File Size : 48,9 Mb
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Description :


Materials Transactions Jim

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 16
Total Download : 259
File Size : 51,7 Mb
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Description :


Iron Steelmaker

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 32
Total Download : 627
File Size : 41,5 Mb
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Description :


Eco Materials Processing Design Vii

Author by : Hyung Sun Kim
Languange : en
Publisher by : Trans Tech Pubn
Format Available : PDF, ePub, Mobi
Total Read : 81
Total Download : 950
File Size : 49,5 Mb
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Description : This collection offers materials researchers and end-users a wealth of new knowledge encompassing the whole spectrum of ecology, eco-materials, nano-materials, bio-materials, recycling, environmental protection and materials related to energy conversion. The collection is divided into seven sections: The first section deals with photocatalysts for controlling air pollution, water pollution, de-odorizing, self-cleaning, power light sources, and standardization of the methodology of photocatalytic reactivity. The second section deals with the incorporation of end-life strategies into materials design. The third section covers the use of non-hazardous alternatives as substitutes for traditionally hazardous components. The fourth section covers the treatment of waste materials. The fifth presents a vision of manufacturing as using more environmentally-friendly processing (eco-processing) and eco-materials design; as well as biomaterials. The final section covers energy-related or energy-conversion related materials such as hydrogen energy/fuel-cells or batteries. Altogether, this makes the book essential reading for all of those who care about preserving the world for future generations.


2004 54th Electronic Components And Technology Conference

Author by : IEEE Components, Packaging and Manufacturing Technology Society Staff
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 34
Total Download : 979
File Size : 52,9 Mb
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Description :