Description : Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Description : Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Description : This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Description : The past twenty years have seen many important advances in plastic encapsulated microelectronics (PEM) technology. Thanks to new packaging materials, improved design, increased reliability testing, and other important developments, PEMs are now perceived as a dependable and, in many cases, more cost-effective option for a wide range of electronic systems applications. Nevertheless, there continues to be a surprising dearth of authoritative references on the subject. Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases. For the first time between two covers, here is a comprehensive, critical review of the state of the art in PEMs and assemblies that incorporate them. The most timely book on the subject, it provides professionals with a systematic, scientific exploration of crucial technical and reliability issues concerning the manufacture and use of PEMs-with special attention focusing on environment-specific applications. Among the important topics covered in detail: Encapsulating materials-composition, shapes, and sizes Fabrication technology-with an in depth look at potential defects that can occur during each phase of production Electronic system manufacturing using PEMs-with extensive coverage of thermomechanical stress induced failures that can occur during assembly Failure mechanisms, sites, and modes Failure analysis techniques-the relative strengths and weaknesses of each type The pros and cons of current screening techniques for reliability conformance and quality improvement and the defects they can induce Current qualification and life-testing techniques and their effectiveness in simulating use conditions Plastic-Encapsulated Microelectronics is an indispensable resource for researchers and practicing mechanical and electrical engineers working in the electronics, aerospace, and automotive industries, in space agencies, or in the defense industry. The most timely and authoritative reference on the subject, Plastic- Encapsulated Microelectronics provides professionals with a systematic, scientific exploration of crucial technical and reliability issues concerning the manufacture and use of PEMs. Comprehensive in scope, it offers detailed coverage of important topics in encapsulating materials; fabrication technology; electronic system manufacturing using PEMs; failure mechanisms, sites, and modes; failure analysis techniques; current screening techniques for reliability conformance and quality; current qualification and life-testing techniques; and more: Offers a systematic critical review of the state of the art in PEM design, manufacture, reliability testing, and more Covers a wide range of issues in PEM applications with special attention given to environment-specific PEM applications Features science-based explanations of manufacturing failures-especially thermo-mechanical, stress-induced failures that can occur during assembly of PEM devices on circuit cards Explores current screening techniques and introduces a philosophy of screening based on the "physics of failure"
Description : One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.