Materials For Advanced Packaging

Author by : Daniel Lu
Languange : en
Publisher by : Springer
Format Available : PDF, ePub, Mobi
Total Read : 49
Total Download : 656
File Size : 53,9 Mb
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Description : Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.


International Symposium On Advanced Packaging Materials

Author by : C. P. Wong
Languange : en
Publisher by : IEEE
Format Available : PDF, ePub, Mobi
Total Read : 30
Total Download : 109
File Size : 43,7 Mb
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Description : The 5th International Symposium on Advanced Packaging Materials was devoted to the advances made in electronic packaging materials. Topics covered in these proceedings include adhesives, integral passive materials, on-chip interconnect materials, underfills and encapsulent materials.


8th International Advanced Packaging Materials Symposium

Author by : Components, Packaging & Manufacturing Technology Society
Languange : en
Publisher by : Institute of Electrical & Electronics Engineers(IEEE)
Format Available : PDF, ePub, Mobi
Total Read : 55
Total Download : 544
File Size : 51,7 Mb
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Description :


Bio Based Materials For Food Packaging

Author by : Shakeel Ahmed
Languange : en
Publisher by : Springer
Format Available : PDF, ePub, Mobi
Total Read : 27
Total Download : 905
File Size : 46,5 Mb
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Description : This book provides an overview of the lastest developments in biobased materials and their applications in food packaging. Written by experts in their respective research domain, its thirteen chapters discuss in detail fundamental knowledge on bio based materials. It is intended as a reference book for researchers, students, research scholars, academicians and scientists seeking biobased materials for food packaging applications.


Proceedings

Author by :
Languange : en
Publisher by : IEEE
Format Available : PDF, ePub, Mobi
Total Read : 61
Total Download : 698
File Size : 44,6 Mb
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Description : This collection of papers from the symposium discusses electrical design, analysis and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.


Proceedings

Author by :
Languange : en
Publisher by : IEEE
Format Available : PDF, ePub, Mobi
Total Read : 70
Total Download : 452
File Size : 43,6 Mb
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Description : This collection of papers from the symposium discusses electrical design, analysis and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.


International Symposium On Advanced Packaging Materials

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 98
Total Download : 958
File Size : 53,5 Mb
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Description :


International Symposium On Advanced Packaging Materials

Author by :
Languange : en
Publisher by : International Society of Hybrid
Format Available : PDF, ePub, Mobi
Total Read : 44
Total Download : 544
File Size : 52,6 Mb
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Description : These conference proceedings cover such topics as: high density packaging materials; automotive electronics; system level packaging; chip scale packaging; optoelectronics; power packaging; sensors; actuators, and MEMS; flex circuits; and thermal management.


Advanced Materials For Thermal Management Of Electronic Packaging

Author by : Xingcun Colin Tong
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 91
Total Download : 140
File Size : 49,6 Mb
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Description : The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.


Proceedings 3rd International Symposium On Advanced Packaging Materials

Author by : International Symposium on Advanced Packaging Materials
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 35
Total Download : 223
File Size : 55,8 Mb
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Description :