Mechanics Of Solder Alloy Interconnects

Author by : Darrel R. Frear
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 29
Total Download : 390
File Size : 55,5 Mb
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Description : The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.


Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging

Author by : Ephraim Suhir
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 83
Total Download : 344
File Size : 53,6 Mb
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Description : This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.


Lead Free Electronic Solders

Author by : KV Subramanian
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 55
Total Download : 441
File Size : 46,7 Mb
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Description : Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.


Failure Modes And Mechanisms In Electronic Packages

Author by : P. Singh
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 13
Total Download : 340
File Size : 51,5 Mb
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Description : With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.


Modeling And Simulation For Microelectronic Packaging Assembly

Author by : Sheng Liu
Languange : en
Publisher by : John Wiley & Sons
Format Available : PDF, ePub, Mobi
Total Read : 34
Total Download : 106
File Size : 44,8 Mb
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Description : Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging


Applications Of Experimental Mechanics To Electronic Packaging

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 97
Total Download : 239
File Size : 53,6 Mb
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Description : Papers presented at the ASME International Mechanical Engineering Congress and Exposition.


Lead Free Solder

Author by : John Hock Lye Pang
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 21
Total Download : 181
File Size : 42,7 Mb
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Description : Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.


Proceedings Of The Asme Materials Division

Author by : Robert C. Wetherhold
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 16
Total Download : 272
File Size : 48,8 Mb
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Description :


Microvias

Author by : John H. Lau
Languange : en
Publisher by : McGraw Hill Professional
Format Available : PDF, ePub, Mobi
Total Read : 89
Total Download : 207
File Size : 43,7 Mb
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Description : State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.


Proceedings Of The Asme Materials Division 2002

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 95
Total Download : 552
File Size : 52,7 Mb
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Description : Annotation These 50 papers from the November 2002 conference in New Orleans represent recent advances in materials processing science, damage mechanics, and the mechanics of granular materials. They also discuss: electric and magnetic phenomena in micro and nano-scale systems; design and manufacture of composites; and, the processing, characterization, and modeling of novel nanoengineering and surface engineered materials. Annotation (c)2003 Book News, Inc., Portland, OR (booknews.com).