Moisture Sensitivity Of Plastic Packages Of Ic Devices

Author by : X.J. Fan
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 27
Total Download : 158
File Size : 49,6 Mb
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Description : Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.


3d Microelectronic Packaging

Author by : Yan Li
Languange : en
Publisher by : Springer
Format Available : PDF, ePub, Mobi
Total Read : 59
Total Download : 754
File Size : 49,7 Mb
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Description : This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.


Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging

Author by : Ephraim Suhir
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 40
Total Download : 628
File Size : 42,9 Mb
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Description : This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.


Microelectronics Failure Analysis

Author by :
Languange : en
Publisher by : ASM International
Format Available : PDF, ePub, Mobi
Total Read : 56
Total Download : 800
File Size : 53,9 Mb
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Description : For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron


Electronic Packaging For High Reliability Low Cost Electronics

Author by : Rao Tummala
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 91
Total Download : 229
File Size : 48,5 Mb
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Description : Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997


Characterization Of Integrated Circuit Packaging Materials

Author by : Thomas Moore
Languange : en
Publisher by : Elsevier
Format Available : PDF, ePub, Mobi
Total Read : 96
Total Download : 406
File Size : 45,5 Mb
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Description : Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.


Advances In Electronic Packaging

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 73
Total Download : 312
File Size : 53,9 Mb
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Description :


Reliability And Quality In Microelectronic Manufacturing

Author by : Aris Christou
Languange : en
Publisher by : RIAC
Format Available : PDF, ePub, Mobi
Total Read : 73
Total Download : 716
File Size : 44,8 Mb
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Description :


Journal Of Electronic Packaging

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 49
Total Download : 143
File Size : 50,6 Mb
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Description :


Proceedings

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 14
Total Download : 319
File Size : 55,9 Mb
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Description :