Reflow Soldering Processes

Author by : Ning-Cheng Lee
Languange : en
Publisher by : Elsevier
Format Available : PDF, ePub, Mobi
Total Read : 10
Total Download : 219
File Size : 42,7 Mb
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Description : Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process


Reflow Soldering Processes And Troubleshooting

Author by : Ning-Cheng Lee
Languange : en
Publisher by : Newnes
Format Available : PDF, ePub, Mobi
Total Read : 66
Total Download : 101
File Size : 40,5 Mb
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Description : Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process


Soldering Processes And Equipment

Author by : Michael Pecht
Languange : en
Publisher by : John Wiley & Sons
Format Available : PDF, ePub, Mobi
Total Read : 95
Total Download : 605
File Size : 44,9 Mb
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Description : Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.


Lead Free Solder Interconnect Reliability

Author by : Dongkai Shangguan
Languange : en
Publisher by : ASM International
Format Available : PDF, ePub, Mobi
Total Read : 24
Total Download : 729
File Size : 45,7 Mb
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Description :


Thermal Coupling Method For Reflow Soldering Process

Author by : Chun Sean Lau
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 56
Total Download : 416
File Size : 42,7 Mb
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Description :


The Smt Step By Step Collection 2006

Author by :
Languange : en
Publisher by : PennWell Books
Format Available : PDF, ePub, Mobi
Total Read : 40
Total Download : 310
File Size : 52,9 Mb
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Description : The Surface Mount Technology columns, the “Step Series,” are a mainstay in the semiconductor industry. Written by prominent industry leaders, each column from the 2005 year and published in SMT, addresses a critical 'step' in the manufacturing process, from the initial design stages through final rework. This technology driven series represents the most advanced research and creative solutions for the one of the most complex and capital intense industries in the world economy. In addition to the step series, SMT also includes its lead-free series of columns published in 2005. As the world prepares for lead-free manufacturing and the enactment of the Restrictions on Hazardous Materials directive, massive changes are happening for the surface mount assembly sector. The inclusion of these articles represents a year's worth of counsel, technology and research at a critical time for the industry. Key features include: --Best practices and innovative ideas for surface mount assemblers --How to guidelines in the conversion to lead-free manufacturing --Insight into the new WEEE and RoHS directives --Guest essay by longetime SMT columnist Rob Rowland on the state of the industry. The Surface Mount Technology columns, the “Step Series,” are a mainstay in the semiconductor industry. Written by prominent industry leaders, each column from the 2005 year and published in SMT, addresses a critical 'step' in the manufacturing process, from the initial design stages through final rework. This technology driven series represents the most advanced research and creative solutions for the one of the most complex and capital intense industries in the world economy. In addition to the step series, SMT also includes its lead-free series of columns published in 2005. As the world prepares for lead-free manufacturing and the enactment of the Restrictions on Hazardous Materials directive, massive changes are happening for the surface mount assembly sector. The inclusion of these articles represents a year's worth of counsel, technology and research at a critical time for the industry. Key features include: --Best practices and innovative ideas for surface mount assemblers --How to guidelines in the conversion to lead-free manufacturing --Insight into the new WEEE and RoHS directives --Guest essay by longetime SMT columnist Rob Rowland on the state of the industry.


Lead Free Solder Process Development

Author by : Gregory Henshall
Languange : en
Publisher by : John Wiley & Sons
Format Available : PDF, ePub, Mobi
Total Read : 51
Total Download : 395
File Size : 43,7 Mb
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Description : Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.


Mechanics Of Solder Alloy Interconnects

Author by : Darrel R. Frear
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 49
Total Download : 671
File Size : 47,6 Mb
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Description : The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.


Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging

Author by : Ephraim Suhir
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 75
Total Download : 302
File Size : 52,8 Mb
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Description : This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.


Cleaning Printed Wiring Assemblies In Today S Environment

Author by : L. Hymes
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 37
Total Download : 498
File Size : 48,8 Mb
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Description : The impetus to create this book originated from several concerns. One of these was the perceived value to the industry of a collection in one volume of a wide range of information pertinent to the reasons and techniques for de fluxing printed wiring assemblies (PWAs). This book is expected to be of use not only to those engaged in the electronics packaging industry but also to those in related fields seeking information concerning viable methods of dealing with one of the en vironmental issues of our time: the destruction of the ozone layer surrounding and protecting the planet with which we have been entrusted. The volume of information relative to providing PW As free of residues ad versely impacting operation, reliability, and life of electronic products is grow ing, and it will continue to expand at an accelerated rate as we seek to match our technology needs and desires with our environmental responsibilities. At the time ofthis writing, which has spanned the latter portion of 1989 and early 1990, the issue of choosing a new approach to producing PW As free of detrimental residues while using environmentally acceptable manufacturing techniques ap peared to be the major concern of the vast majority of those involved in the printed wiring assembly industry. To many this meant the use of different clean ing media and/or process or equipment enhancements; to others it meant the elimination of the need to clean through materials or process changes.