Reliability and Failure Analysis of High Power LED Packaging

Reliability and Failure Analysis of High Power LED Packaging
Author: Cher Ming Tan,Preetpal Singh
Publsiher: Woodhead Publishing
Total Pages: 190
Release: 2022-09-24
ISBN: 012822407X
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

Reliability and Failure Analysis of High Power LED Packaging Book Excerpt:

Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs

Solid State Lighting Reliability

Solid State Lighting Reliability
Author: W.D. van Driel,X.J. Fan
Publsiher: Springer Science & Business Media
Total Pages: 618
Release: 2012-09-06
ISBN: 1461430674
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

Solid State Lighting Reliability Book Excerpt:

Solid State Lighting Reliability: Components to Systems begins with an explanation of the major benefits of solid state lighting (SSL) when compared to conventional lighting systems including but not limited to long useful lifetimes of 50,000 (or more) hours and high efficacy. When designing effective devices that take advantage of SSL capabilities the reliability of internal components (optics, drive electronics, controls, thermal design) take on critical importance. As such a detailed discussion of reliability from performance at the device level to sub components is included as well as the integrated systems of SSL modules, lamps and luminaires including various failure modes, reliability testing and reliability performance. A follow-up, Solid State Lighting Reliability Part 2, was published in 2017.

LED Packaging for Lighting Applications

LED Packaging for Lighting Applications
Author: Shen Liu,Xiaobing Luo
Publsiher: John Wiley & Sons
Total Pages: 375
Release: 2011-07-05
ISBN: 0470827831
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

LED Packaging for Lighting Applications Book Excerpt:

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the book’s Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led

Solid State Lighting Reliability Part 2

Solid State Lighting Reliability Part 2
Author: Willem Dirk van Driel,Xuejun Fan,Guo Qi Zhang
Publsiher: Springer
Total Pages: 606
Release: 2017-07-11
ISBN: 3319581759
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

Solid State Lighting Reliability Part 2 Book Excerpt:

In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.

Prognostics and Health Management of Electronics

Prognostics and Health Management of Electronics
Author: Michael G. Pecht,Myeongsu Kang
Publsiher: John Wiley & Sons
Total Pages: 800
Release: 2018-08-15
ISBN: 1119515300
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

Prognostics and Health Management of Electronics Book Excerpt:

An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenance A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost and benefits of prognostic implementations develop novel methods for in situ monitoring of products and systems in actual life-cycle conditions enable condition-based (predictive) maintenance increase system availability through an extension of maintenance cycles and/or timely repair actions; obtain knowledge of load history for future design, qualification, and root cause analysis reduce the occurrence of no fault found (NFF) subtract life-cycle costs of equipment from reduction in inspection costs, downtime, and inventory Prognostics and Health Management of Electronics also explains how to understand statistical techniques and machine learning methods used for diagnostics and prognostics. Using this valuable resource, electrical engineers, data scientists, and design engineers will be able to fully grasp the synergy between IoT, machine learning, and risk assessment.

International Conference on Energy and Power Engineering EPE2014

International Conference on Energy and Power Engineering  EPE2014
Author: Anonim
Publsiher: DEStech Publications, Inc
Total Pages: 485
Release: 2014-06-24
ISBN: 1605951803
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

International Conference on Energy and Power Engineering EPE2014 Book Excerpt:

The 2014 International Conference on Energy and Power Engineering (EPE2014), will be held on April 26–27, 2014, in Hong Kong, China. The aim of this international convention is to bring together experts and scholars from around the world and offer them a chance to share the latest research results in the field of Energy and Power Engineering. We all know that over the past few decades, a great change has happened in the field of the environment technology, and the science technology is growing faster and faster. In order to keep up with the daily changing situation, we have sent invitations to experts, scholars and other people who have devoted himself in related fields, and it is a great honor to us that most of them have accepted our invitation and supported the EPE2014 with their latest studies. Up till now, we have received over three hundred papers from various countries; this shows that there has been a growing interest in the field of energy and power engineering. Among those papers received, we have eventually chosen about a hundred to be presented and included in this proceeding. These papers generally represented the current research status in this field and the future trend. We sincerely believe that these papers could be valuable to the future work of yours. Finally, on behalf of the committee, I would like to deeply express our gratitude to those who have supported the EPE2014, especially the international experts who helped reviewing papers, the DEStech Publications help publish the conference proceedings, and last but not least, the authors of these inspiring papers. Without the help from these people, EPE2014 would not be as half successful as it is now. Here, welcome to EPE2014 and let’s hope that it will be a great success. Tim Chou

Nano Bio Electronic Photonic and MEMS Packaging

Nano Bio  Electronic  Photonic and MEMS Packaging
Author: C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi Li
Publsiher: Springer Nature
Total Pages: 582
Release: 2021-03-17
ISBN: 303049991X
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

Nano Bio Electronic Photonic and MEMS Packaging Book Excerpt:

This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.

Thermal Management for LED Applications

Thermal Management for LED Applications
Author: Clemens J.M. Lasance,András Poppe
Publsiher: Springer Science & Business Media
Total Pages: 551
Release: 2013-09-17
ISBN: 1461450918
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

Thermal Management for LED Applications Book Excerpt:

Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

Reliability of Organic Compounds in Microelectronics and Optoelectronics

Reliability of Organic Compounds in Microelectronics and Optoelectronics
Author: Willem Dirk van Driel,Maryam Yazdan Mehr
Publsiher: Springer Nature
Total Pages: 552
Release: 2022
ISBN: 3030815765
Category: Electronic books
Language: EN, FR, DE, ES & NL

Reliability of Organic Compounds in Microelectronics and Optoelectronics Book Excerpt:

This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems. Presents methodologies for analysing the reliability, failure, and degradation of different organic materials, used in optoelectronics and microelectronics; Provides an overview of different failure mechanisms in different organic materials; Explains how to correlate product performance and reliability to materials degradation; Provides an overview of simulation techniques and methodologies to predict lifetime and reliability of engineering materials and components; Integrates several degradation causes in different materials (thermal, moisture, light radiation, mechanical damage, and more) into large-scale system solutions in several industrial domains (lighting, automotive, oil/gas, and transport and more); Includes case studies from different failure/degradation mechanisms in different industrial sectors.

Microcircuit Reliability Bibliography

Microcircuit Reliability Bibliography
Author: Anonim
Publsiher: Unknown
Total Pages: 135
Release: 1978
ISBN: 1928374650XXX
Category: Integrated circuits
Language: EN, FR, DE, ES & NL

Microcircuit Reliability Bibliography Book Excerpt:

III Nitrides Light Emitting Diodes Technology and Applications

III Nitrides Light Emitting Diodes  Technology and Applications
Author: Jinmin Li,Junxi Wang,Xiaoyan Yi,Zhiqiang Liu,Tongbo Wei,Jianchang Yan,Bin Xue
Publsiher: Springer Nature
Total Pages: 285
Release: 2020-08-31
ISBN: 9811579490
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

III Nitrides Light Emitting Diodes Technology and Applications Book Excerpt:

The book provides an overview of III-nitride-material-based light-emitting diode (LED) technology, from the basic material physics to the latest advances in the field, such as homoepitaxy and heteroepitaxy of the materials on different substrates. It also includes the latest advances in the field, such as approaches to improve quantum efficiency and reliability as well as novel structured LEDs. It explores the concept of material growth, chip structure, packaging, reliability and application of LEDs. With spectra coverage from ultraviolet (UV) to entire visible light wavelength, the III-nitride-material-based LEDs have a broad application potential, and are not just limited to illumination. These novel applications, such as health & medical, visible light communications, fishery and horticulture, are also discussed in the book.

Organosilicon Compounds

Organosilicon Compounds
Author: Vladimir Ya Lee
Publsiher: Academic Press
Total Pages: 410
Release: 2017-09-25
ISBN: 0128142146
Category: Science
Language: EN, FR, DE, ES & NL

Organosilicon Compounds Book Excerpt:

Organosilicon Compounds: Experiment (Physico-Chemical Studies) and Applications, volume 2, also contains two parts. In its first part, Experiment (Physico-Chemical Studies), the application of modern instrumental tools (such as X-ray crystallography, 29Si NMR spectroscopy, UV-Photoelectron Spectroscopy, and other methods) for assessing the structures of organosilicon compounds is described. The second part, Applications, reviews the current research in the field of material science, specifically the use of organosilicon compounds in synthetic chemistry directed towards the creation of new materials. Organosilicon Compounds: From Theory to Synthesis to Applications provides a comprehensive overview of this important area of organic and organometallic chemistry, dealing with compounds containing carbon–silicon bonds. This field, which includes compounds that are widely encountered in commercial products such as in the fabrication of sealants, adhesives, and coatings, has seen many milestone discoveries reported during the last two decades. Beginning with the theoretical aspects of organosilicon compounds’ structure and bonding, the book then explores their synthetic aspects, including main group element organosilicon compounds, transition metal complexes, silicon cages and clusters, low-coordinate organosilicon derivatives (cations, radicals, anions, multiple bonds to silicon, silaaromatics), and more. Next, readers will find valuable sections that explore physical and chemical properties of organosilicon compounds by means of X-ray crystallography, 29Si NMR spectroscopy, photoelectron spectroscopy, and other methods. Finally, the work delves into applications for industrial uses and in many related fields, such as polymers, material science, nanotechnology, bioorganics, and medicinal silicon chemistry. Features valuable contributions from prominent experts cover both fundamental (theoretical, synthetic, physico-chemical) and applied (material science, applications) aspects of modern organosilicon chemistry Covers important breakthroughs in the field as well as with the historically significant achievements of the past Includes applied information for a wide range of specialists from junior and senior researchers (from both academia and industry), working in organometallic, organosilicon, main group element, transition metal, and industrial silicon chemistry, as well as those from interdisciplinary fields such as polymer, material science, nanotechnology

Component Reliability for Electronic Systems

Component Reliability for Electronic Systems
Author: Titu I. Băjenescu,Marius I. Bâzu
Publsiher: Artech House
Total Pages: 685
Release: 2010
ISBN: 1596934360
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

Component Reliability for Electronic Systems Book Excerpt:

The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.

From LED to Solid State Lighting

From LED to Solid State Lighting
Author: S. W. Ricky Lee,Jeffery C. C. Lo,Mian Tao,Huaiyu Ye
Publsiher: John Wiley & Sons
Total Pages: 260
Release: 2021-09-28
ISBN: 1118881478
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

From LED to Solid State Lighting Book Excerpt:

FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.

Reliability of RoHS Compliant 2D and 3D IC Interconnects

Reliability of RoHS Compliant 2D and 3D IC Interconnects
Author: John Lau
Publsiher: McGraw Hill Professional
Total Pages: 560
Release: 2010-10-22
ISBN: 007175380X
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

Reliability of RoHS Compliant 2D and 3D IC Interconnects Book Excerpt:

Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration

The International Journal of Microcircuits and Electronic Packaging

The International Journal of Microcircuits and Electronic Packaging
Author: Anonim
Publsiher: Unknown
Total Pages: 582
Release: 2000
ISBN: 1928374650XXX
Category: Electronic packaging
Language: EN, FR, DE, ES & NL

The International Journal of Microcircuits and Electronic Packaging Book Excerpt:

Proceedings of the International Symposium on Microelectronics

Proceedings of the     International Symposium on Microelectronics
Author: Anonim
Publsiher: Unknown
Total Pages: 920
Release: 2000
ISBN: 1928374650XXX
Category: Hybrid integrated circuits
Language: EN, FR, DE, ES & NL

Proceedings of the International Symposium on Microelectronics Book Excerpt:

IWIPP

IWIPP
Author: Anonim
Publsiher: Unknown
Total Pages: 135
Release: 2000
ISBN: 1928374650XXX
Category: Electronic packaging
Language: EN, FR, DE, ES & NL

IWIPP Book Excerpt:

Seeing Photons

Seeing Photons
Author: National Research Council,Division on Engineering and Physical Sciences,Standing Committee on Technology Insightâ¬"Gauge, Evaluate, and Review,Committee on Developments in Detector Technologies
Publsiher: National Academies Press
Total Pages: 194
Release: 2010-10-28
ISBN: 0309153042
Category: Technology & Engineering
Language: EN, FR, DE, ES & NL

Seeing Photons Book Excerpt:

The Department of Defense recently highlighted intelligence, surveillance, and reconnaissance (ISR) capabilities as a top priority for U.S. warfighters. Contributions provided by ISR assets in the operational theaters in Iraq and Afghanistan have been widely documented in press reporting. While the United States continues to increase investments in ISR capabilities, other nations not friendly to the United States will continue to seek countermeasures to U.S. capabilities. The Technology Warning Division of the Defense Intelligence Agency's (DIA) Defense Warning Office (DWO) has the critical responsibility, in collaborations with other components of the intelligence community (IC), for providing U.S. policymakers insight into technological developments that may impact future U.S. warfighting capabilities. To this end, the IC requested that the National Research Council (NRC) investigate and report on key visible and infrared detector technologies, with potential military utility, that are likely to be developed in the next 10-15 years. This study is the eighth in a series sponsored by the DWO and executed under the auspices of the NRC TIGER (Technology Insight-Gauge, Evaluate, and Review) Standing Committee.

2000 International Symposium on Microelectronics

2000 International Symposium on Microelectronics
Author: Anonim
Publsiher: Unknown
Total Pages: 916
Release: 2000
ISBN: 1928374650XXX
Category: Electronic ceramics
Language: EN, FR, DE, ES & NL

2000 International Symposium on Microelectronics Book Excerpt:

This text constitutes proceedings from the International Symposium on Microelectronics that took place in Boston, Massachusetts in September, 2000.