Soldering Processes And Equipment

Author by : Michael Pecht
Languange : en
Publisher by : John Wiley & Sons
Format Available : PDF, ePub, Mobi
Total Read : 11
Total Download : 822
File Size : 46,9 Mb
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Description : Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.


Solders And Soldering

Author by : Howard H. Manko
Languange : en
Publisher by : McGraw Hill Professional
Format Available : PDF, ePub, Mobi
Total Read : 75
Total Download : 256
File Size : 54,5 Mb
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Description : Get the latest developments in solder technology You can't work in electronics without solder -- and you shouldn’t work with solder without Solders and Soldering, Fourth Edition. Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You’ll learn 29 different methods for soldering and heating (for both automatic and manual procedures), and learn about the strengths and weaknesses of each method for varying applications. This up-to-date edition deals at length with modern cleaning materials and processes, emphasizing EPA and OSHA guidelines and regulations, and provides you with state-of-the-art techniques for soldering with miniaturized circuit boards.


Soldering Handbook For Printed Circuits And Surface Mounting

Author by : Howard H. Manko
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 26
Total Download : 641
File Size : 54,7 Mb
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Description : Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.


Lead Free Soldering

Author by : Jasbir Bath
Languange : en
Publisher by : Springer Science & Business Media
Format Available : PDF, ePub, Mobi
Total Read : 17
Total Download : 200
File Size : 47,9 Mb
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Description : The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.


Manufacturing

Author by : Beno Benhabib
Languange : en
Publisher by : CRC Press
Format Available : PDF, ePub, Mobi
Total Read : 88
Total Download : 905
File Size : 40,5 Mb
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Description : From concept development to final production, this comprehensive text thoroughly examines the design, prototyping, and fabrication of engineering products and emphasizes modern developments in system modeling, analysis, and automatic control. This reference details various management strategies, design methodologies, traditional production techniques, and assembly applications for clear illustration of manufacturing engineering technology in the modern age. Considers a variety of methods for product design including axiomatic design, design for X, group technology, and the Taguchi method, as well as modern production techniques including laser-beam machining, microlithography.


Reflow Soldering Processes

Author by : Ning-Cheng Lee
Languange : en
Publisher by : Elsevier
Format Available : PDF, ePub, Mobi
Total Read : 78
Total Download : 314
File Size : 43,5 Mb
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Description : Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process


Reflow Soldering Processes And Troubleshooting

Author by : Ning-Cheng Lee
Languange : en
Publisher by : Newnes
Format Available : PDF, ePub, Mobi
Total Read : 80
Total Download : 403
File Size : 51,6 Mb
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Description : Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process


Smt Soldering Handbook

Author by : RUDOLF STRAUSS
Languange : en
Publisher by : Elsevier
Format Available : PDF, ePub, Mobi
Total Read : 93
Total Download : 534
File Size : 53,5 Mb
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Description : Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology


General Summary 1997

Author by :
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 76
Total Download : 345
File Size : 43,5 Mb
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Description :


Lead Free Solder Interconnect Reliability

Author by : Dongkai Shangguan
Languange : en
Publisher by : ASM International
Format Available : PDF, ePub, Mobi
Total Read : 25
Total Download : 580
File Size : 49,8 Mb
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Description :