Description : Learn to generate high manufacturing yields, low testing costs, and reproducible designs using the latest components of surface mount technology (SMT)! Manufacturers, managers, engineers, students, and others who work with printed-circuit boards will find a wealth of cutting-edge information about SMT and fine pitch technology (FPT) in this new edition. Practical data and clear illustrations combine to clearly and accurately present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for today's miniaturized electronics packaging.
Description : Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
Description : Design Guidelines for Surface Mount Technology covers the basics and the mechanics of surface mounted design technology. Surface mount technology (SMT) embodies an automated circuit assembly process, using a generation of electronic components called surface mounted devices (SMDs). Organized into eight chapters, the book discusses the component selection, space planning, materials and processes, and total concept needed to ensure a manufacturable design. The opening chapters of the book examine the significant requirements and variables affecting SMT and SMDs. The book then deals with the substrate materials specifications, including fabrication and material planning, assembly, design rules, layout guidelines, package outlines, and bar code labeling. The next chapters describe the manufacturing and assembly processes in SMDs and process-proven footprint patterns for each of the component types used, as well as guidelines for creating a suitable pattern on future products. Other chapters discuss the component spacing requirements for SMT and the generation of footprint patterns for passive and active components of SMDs. The concluding chapter describes the design criteria for maximizing machine insertion of leaded electronic components into printed circuit boards (PCBs). These criteria aid the PCB designer by detailing the considerations and some of the trade-offs that will provide reliable insertion in a production environment. Supplementary texts on surface mount equipment, supplies, and services are also provided. Design engineers and researchers will find this book invaluable.
Description : A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Description : The days of troubleshooting a piece of gear armed only with a scope, voltmeter, and a general idea of how the hardware works are gone forever. As technology continues to drive equipment design forward, maintenance difficulties will continue to increase, and those responsible for maintaining this equipment will continue to struggle to keep up. The Electronic Systems Maintenance Handbook, Second Edition establishes a foundation for servicing, operating, and optimizing audio, video, computer, and RF systems. Beginning with an overview of reliability principles and properties, a team of top experts describes the steps essential to ensuring high reliability and minimum downtime. They examine heat management issues, grounding systems, and all aspects of system test and measurement. They even explore disaster planning and provide guidelines for keeping a facility running under extreme circumstances. Today more than ever, the reliability of a system can have a direct and immediate impact on the profitability of an operation. Advocating a carefully planned, systematic maintenance program, the richly illustrated Electronic Systems Maintenance Handbook helps engineers and technicians meet the challenges inherent in modern electronic equipment and ensure top quality performance from each piece of hardware.
Description : "Handbook of Fine Pitch Surface Mount Technology (FPT) is a "one-stop" guide to the state of the art of FPT. For professionals active in FPT research and development, those who wish to master FPT problem-solving methods, and those who must choose a high-yield and cost-effective manufacturing process for their interconnect systems, here is a timely summary of progress in all aspects of this fascinating field." "The topics covered include fine pitch surface mount packages and their solderability characteristics, printed circuit board materials and designs, solder paste and printing technology, pick and place, solder volume estimation, vapor phase, convection/IR, forced convection with nitrogen, pulsed thermode hotbar solder reflow methods, non-CFC (aqueous, semiaqueous, and no-clean) cleaning, inspection, repair, total quality management, statistical process control, thermal management, electrical testing, reliability, and technical management." "This book offers contributions from a wide array of experts who address areas covering the most advanced research and solutions technology in the field today. With this volume, you will develop a practical understanding of the economic, design, material, process, equipment, quality, testing, reliability, and management issues of FPT."--BOOK JACKET.Title Summary field provided by Blackwell North America, Inc. All Rights Reserved
Description : Designing PCBs is made easier with the help of today's sophisticated CAD tools, but many companies' requirements do not justify the acquisition cost and learning curve associated with specialized PCB design software. Printed Circuit Board Design Using AutoCAD helps design engineers and students get the most out of their AutoCAD workstation, showing tips and techniques to improve your design process. The book is organized as a series of exercises that show the reader how to draft electronic schematics and to design single-sided, double-sided, and surface-mount PCBs.Coverage includes drafting schematics, designing PCB artwork, and preparation of detailed fabrication and assembly drawings for PCBs designed on other EDA systems. Appendices on the Gerber and Excellon formats are vital information for anyone involved in professional PCB design. An introductory chapter gives an overview of PCB manufacturing technology and design techniquesIn addition to the tips and techniques, the author has provided a copy of AutoPADS, a proprietary toolkit for PCB designers using AutoCAD. The disk includes the AutoPADS conversion utilities, sample files for the book exercises, and AutoCAD libraries for schematic drafting and PCB design. The AutoPADS utilities allow bidirectional transfer of Gerber format photophlotter data and Excellon format numerical control (NC) drill data from AutoCAD. The AutoPADS utilities also allow input of Hewlett-Packard Graphics Language (HPGL) data from other computer-aided design systems into AutoCAD. ABOUT THE AUTHORChris Schroeder is the Chief Engineer, Electronics, for Crane Technologies Group, Inc., Daytona Beach, Florida, a leading automotive aftermarket and original equipment supplier. He has 19 years of engineering, marketing, and management experience in the electronics industry and has a broad, yet in-depth technical knowledge of both design and manufacturing. His specialized areas of design expertise include: embedded controls using RISC microcontroller technology, assembly language programming, magnetic design for switching power supplies and ignition coils, and printed circuit board design, including the use of surface mount technology.