The 1999 International Symposium And Exhibition On Advanced Packaging Materials

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The 1999 International Symposium And Exhibition On Advanced Packaging Materials

Author by : International Symposium on Advanced Packaging Materials
Languange : en
Publisher by :
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Total Read : 35
Total Download : 172
File Size : 50,5 Mb
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Materials For Advanced Packaging

Author by : Daniel Lu
Languange : en
Publisher by : Springer
Format Available : PDF, ePub, Mobi
Total Read : 91
Total Download : 706
File Size : 50,6 Mb
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Description : Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.


Handbook Of Lead Free Solder Technology For Microelectronic Assemblies

Author by : Karl J. Puttlitz
Languange : en
Publisher by : CRC Press
Format Available : PDF, ePub, Mobi
Total Read : 28
Total Download : 867
File Size : 49,9 Mb
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Description : This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.


Electrically Conductive Adhesives

Author by : Rajesh Gomatam
Languange : en
Publisher by : CRC Press
Format Available : PDF, ePub, Mobi
Total Read : 68
Total Download : 840
File Size : 45,6 Mb
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Description : With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers, camcorders, watch electronics, hard-drive suspensions and a myriad of electronic equipments. Environmentally-friendly ECAs offer many advantages vis-à-vis solder, such as simple and low-temperature processing conditions, better thermo mechanical performance and finer pitch. This book is based on the two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to this topic. The book contains a total of 21 papers (reflecting overviews and original research) and is divided into three parts as follows: Part 1: Introduction and Recent Developments, Part 2: Mechanical, Durability and Reliability Aspects and Part 3: Characterization and Properties.


International Symposium On Advanced Packaging Materials

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Languange : en
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Total Read : 70
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File Size : 51,9 Mb
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8th International Advanced Packaging Materials Symposium

Author by : Components, Packaging & Manufacturing Technology Society
Languange : en
Publisher by : Institute of Electrical & Electronics Engineers(IEEE)
Format Available : PDF, ePub, Mobi
Total Read : 27
Total Download : 618
File Size : 40,7 Mb
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2000 3rd Electronics Packaging Technology Conference

Author by : Thiam Beng Lim
Languange : en
Publisher by : Institute of Electrical & Electronics Engineers(IEEE)
Format Available : PDF, ePub, Mobi
Total Read : 76
Total Download : 704
File Size : 52,5 Mb
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Description : Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.


Proceedings

Author by : International Microelectronics and Packaging Society
Languange : en
Publisher by :
Format Available : PDF, ePub, Mobi
Total Read : 34
Total Download : 741
File Size : 46,7 Mb
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Proceedings

Author by : CMP Media
Languange : en
Publisher by :
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Total Read : 56
Total Download : 859
File Size : 54,5 Mb
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