Description : A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment--and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control methods for solder, fluxes, and solder paste * Defines standards of quality and shows how they can be achieved and maintained Widely accepted in industrial and military circles, The Handbook of Machine Soldering is an important resource for production managers, engineers, supervisors, operators, and anyone involved day-to-day in electronic manufacturing. It is a proven text for upper-level undergraduate college courses and for soldering seminars geared toward apprentices and future managers.
Description : Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
Description : This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Description : Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology
Description : This monograph provides an insight review on semiconductor device lead soldering process where various process and material controls are discussed with the aim of achieving zero defect soldering. Quality problems like solderability and visual mechanical problems are discussed and ways to overcome are suggested. Related topics like the corrosion in the microelectronic devices (chip corrosion and lead tarnishing), various techniques like ion chromatography and surface techniques are presented in terms of their applications in the areas of semiconductor device assembly.
Description : Of all the components that go into electronic equipment, the printed circuit probably requires more manufacturing operations-each of which must be per formed by a skilled person-than any other. As a shift supervisor early in my printed circuit career, I had to hire and train personnel for all job functions. The amount of responsibility delegated to my subordinates depended strictly on how well I had been able to train them. Training people can be a trying experience and is always a time-consuming one. It behooved me to help my workers obtain the highest degree of job under standing and skill that they and I were capable of. One hindrance to effective teaching is poor continuity of thought, for example, having to say to a trainee, "Wait a minute; forget what I just told you. We have to go back and do some thing else first. " It was in trying to avoid pitfalls such as this that I undertook a detailed examination of the processes involved, what I thought each trainee had to know, and what questions they would most frequently ask. From this analysis I developed the various process procedures. Only after I had done so was I able to train effectively and with the confidence that I was doing the best possible job. Answers had to be at hand for all of their questions and in what ever detail they needed to know.
Description : Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are described. The book also underscores testing for quality. Reliability, component parts testing, production processes, and the packaged and unpackaged assemblies are discussed. The text also examines standardization of electronics manufacture. Reference to standards, standards of organizations and bodies, assessed quality of companies, and setting up of company standards are considered. The book also discusses the process of selling to the Ministry of Defense. Procurement executive, quality assurance, and procurement executive policies and procedures are clarified. The handbook is a helpful reference for readers wanting to study the processes involved in electronic assembling.